application
1. Electronic equipment: used to bond FPC flexible circuit boards, membrane switches, heat sinks and other components, providing strong bonding and fixing effects.
2. Automobile industry: used for bonding shock-proof foam, fixing metal nameplates and electrical parts, improving the assembly quality and reliability of automobiles.
3. Home appliance products: used for panel bonding, fixing electrical parts, etc., simplifying the assembly process and improving production efficiency.
4. General industry: meets various bonding applications that require high viscosity and temperature resistance, such as equipment fixing, pipeline sealing, etc.
Property
| Product Name | 3M 9471LE Double-Sided Tape |
| Type | Linerless Double-Sided Tape |
| Adhesive | Acrylate |
| Thickness | 0.05mm |
| Color | Transparent |
| Size | Customizable (Common: 1219mm*55m) |
| Key Features | |
| – Adhesion | Strong, suitable for low surface energy materials |
| – Temperature Resistance | Long-term up to 121掳C, short-term higher |
| – Eco-Friendly | ROHS compliant |
| Applications | |
| – Electronics | FPC, heat sinks, etc. |
| – Automotive | Foam bonding, part fixation |
| – Appliances | Panel attachment, part fixation |
| – Industrial | Equipment, pipe fixation |
description
Features
1Low static electricity: Excellent static dissipation performance, suitable for static sensitive environments.
High viscosity: Provides strong adhesion, suitable for permanent fixation.
Durability: Not easy to fall off after long-term use, anti-aging and UV resistance.
Temperature resistance: Suitable for a wide temperature range (-40°C to +90°C).
Waterproof and moisture-proof: Suitable for use in humid environments.
Multi-material compatibility: Suitable for a variety of materials such as metal, plastic, glass, ceramics, etc.
Thin design: The thickness is only 0.05mm, and the appearance is almost not affected after bonding.
Ease of use: Can be cut by hand, easy to use.
Environmental protection: Meets environmental protection standards, safe and non-toxic.
High cost performance: Economical and suitable for large-scale use.
Application areas
1. Electronic manufacturing
Used for fixing and bonding electronic components and circuit boards.
2. Semiconductor packaging
Used for fixing and bonding materials in the semiconductor packaging process.
3. Automotive electronics
Used for fixing and bonding automotive electronic components.
4. Communication equipment
Used for fixing the internal parts of communication equipment such as mobile phones and tablets.
5. Medical electronics
Used for fixing and bonding electronic components in medical equipment.
6. Industrial electronics
Used for fixing electronic components such as industrial control equipment and sensors.
7. Scientific research field
Used for fixing and bonding laboratory equipment and precision instruments.
8. Other fields
Used in any occasion where low static properties and high viscosity are required.
