application
1. It can be used for bonding flexible circuit boards, with good heat shock resistance and excellent bonding performance for plastics and plastic gaskets. It has excellent heat shock resistance and can be used in high-temperature lead-free processes. Its release paper can also be reflowed, and it also has the characteristics of low volatility and easy die-cutting. For example: bonding of flexible circuit boards (over-high-temperature reflow)
2. The release paper will not be carbonized after reflowing at 300 degrees Celsius, which meets the requirements of the lead-free industry
3. Double-sided adhesive tape with adhesive and peeling layer that can withstand the high temperature of lead-free soldering process (300℃).
4. Used to fix FPC and reinforcing board, FPC and frame.
Property
| Specification/Feature | 3M 9077 Tape |
|---|---|
| Product Name | 3M 9077 Double-Sided Tape |
| Thickness | 0.05MM (0.002in.) |
| Substrate | Special Non-woven White Tissue |
| Temperature Resistance | Short-term: 263℃, Long-term: 149℃ |
| Application | High-temperature lead-free processes |
| Adhesive Type | Double-coated, High-temperature Acrylic Adhesive |
| Material Type | Tissue |
| Comparable Products | 3M 9079 (for high-temperature lead-free processes) |
| Other Notes | Suitable for use in flexible circuit board (FPC) bonding and other high-temperature applications |
description
Features
1. High-strength adhesion: High-performance acrylic adhesive is used to provide long-lasting bonding.
2. Thin design: The thickness is extremely thin (0.1 mm), which will not increase the thickness of the bonded material and maintain beauty.
3. Excellent flexibility: The non-woven fabric substrate enables it to fit curved and irregular surfaces.
4. Temperature resistance: It can withstand a certain degree of high and low temperatures and adapt to a variety of working environments.
5. Easy to cut: It can be easily cut into any shape and size as needed.
6. No residue: No glue marks are left after tearing off, and it is easy to clean.
