Hi-Bond HB 750 Conductive Metallic Tape – Technical Datasheet
Key Features
✅ All-Path Conductive – Carbon-loaded adhesive + metal layer for full conductivity.
✅ EMI/RFI Shielding – Ideal for PCB grounding and cable shielding (60dB+ attenuation at 1GHz).
✅ Copper-Aluminum Foil – Optimized balance of conductivity (Cu) and flexibility (Al).
✅ High-Temp Rating – Stable from -20°C to +120°C.
✅ Certified – UL 746C & RoHS compliant.
Limitations & Alternatives
⚠ Not for Dynamic Flexing – Copper layer cracks under repeated bending (use conductive fabric tape).
⚠ Temp-Sensitive – For >120°C, switch to polyimide-based conductive tapes.
