Our Excellent Quality Double Sided UV Release Tape—featuring acrylic adhesive and easy peeling—specializes in wafer dicing. UV-curable adhesion ensures firm wafer fixation during precision cutting, peeling off cleanly without residue or scratches. Durable, stable, and tailored for semiconductor manufacturing, it’s a trusted choice for global electronics suppliers seeking high-performance dicing solutions.
Semiconductor Wafer Mounter dicing Tape single sided thermal release tape
Color
white/blue/yellow
Features
* Adhesive strength becomes almost “zero” by heating and REVALPHA can be removed without damaging substrates. * Substrates can be processed by temporarily fixing a REVALPHA’s pressure sensitive adhesive face to the stage. * Provides a high processing accuracy since substrates are kept in a fixed position. *Three types (rolls, labelers and sheets) are available. * Environmentally friendly since no cleaning is required for substrates.