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E-mail: jack@aiyatape.com

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Brand: AIYA TAPE

Item NO:

OEM service: Offer

Sample: Freely Provided

Delivery time:7 Days

On-time delivery:100.0%

Our UV Curable Dicing Tape is tailored for precision wafer cutting, featuring UV-activated adhesion that secures wafers firmly during processing. After curing, it peels off easily without residue, protecting delicate wafer surfaces from scratches. Durable, stable, and compatible with semiconductor manufacturing, it’s a top choice for electronics suppliers seeking reliable dicing solutions.