Tel: +86 15058222082
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UV Curable Dicing Tape for Wafer Cutting


Phone:+86 15058222082

E-mail: jack@aiyatape.com

WhatsAPP: +86 15870766082


Brand: AIYA TAPE

Item NO:

OEM service: Offer

Sample: Freely Provided

Delivery time:7 Days

On-time delivery:100.0%


Our UV Curable Dicing Tape is tailored for precision wafer cutting, featuring UV-activated adhesion that secures wafers firmly during processing. After curing, it peels off easily without residue, protecting delicate wafer surfaces from scratches. Durable, stable, and compatible with semiconductor manufacturing, it’s a top choice for electronics suppliers seeking reliable dicing solutions.

  • Product Details


ITEMUNITVALUE
Total Thicknessmm0.13
Base Film Thicknessmm0.1
Base FilmPO
LinerPET film
AdhesiveAcrylic Adhesive
Standard Roll Widthmm1200
Standard Roll Lengthm100
Peel force
(Before UV)
gf/25mm1000
Peel force
(After UV)
gf/25mm20
Tensile StrengthN/10mmMD:26N/10mm TD:22N/10mm
Elongation%MD:600%  TD:600%


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