Product Name | High Quality PO Film Wafer UV Dicing Tape Substrate UV Tape For Dicing |
Adhesive Type | Acrylic |
color | Clear/Blue |
Temperature resistance | 100℃ |
Material | PO film |
Adhesion to 304 steel plate | 30.2 oz/in (3.3 N/cm) |
Features | •The PO/PET film was single coated with special adhesive which has high adhesion. With this tape, the wafer or glass would not
fall off or fly off during grinding and dicing.
• Not any residue on the surface of wafer or glass which is good for processing.
• High adhesion before UV.Once UV-light is exposed on, the adhesion is reduced and it can be removed easily
|
Thickness | 0.1-0.2mm |
For more | Please don't hesitate to contact our service. |
Products Application
* This is for package saw like QFN or BGA.
* Mainly used for the package dicing of all kinds of IC wafers.
We can offer professional die cutting service according to customer’s request or drawing (any shape and any size) with above cutting machines. If any question, please do not hesitate to contact with us.
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